PT-2017-3691 · Qualcomm+1 · Qualcomm Snapdragon Mobile Sd 845+2

Publicado 2017-10-02 · Atualizado 2018-05-11 · CVE-2017-18134

Positive Technologies (AI Summary)

CVSS v2.0

10

Alta

Vetor base

AV:N/AC:L/Au:N/C:C/I:C/A:C

Name of the Vulnerable Software and Affected Versions: Android versions prior to security patch level 2018-04-05 on Qualcomm Snapdragon Mobile SD 845, SD 850

Description: The issue is caused by a buffer overflow when processing a response from the SIM card in the Qualcomm User Identity Module component of the Android operating system. This could allow a remote attacker to impact the confidentiality, integrity, and availability of protected information.

Recommendations: For Android versions prior to security patch level 2018-04-05 on Qualcomm Snapdragon Mobile SD 845, SD 850, update to a version with a security patch level of 2018-04-05 or later to resolve the issue.

Correção

Buffer Overflow

Enumeração de Fraquezas

CWE-119

Identificadores relacionados

BDU:2018-00884

CVE-2017-18134

Produtos afetados

Android

Qualcomm Snapdragon Mobile Sd 845

Qualcomm Snapdragon Mobile Sd 850

Referências · 4

• https://nvd.nist.gov/vuln/detail/CVE-2017-18134 · Nota de Segurança
• http://securityfocus.com/bid/103671 · Nota
• https://bdu.fstec.ru/vul/2018-00884 · Nota de Segurança
• https://source.android.com/security/bulletin/2018-04-01 · Aviso do Fabricante