PT-2019-17473 · Lead Technologies · Leadtools

Cory Duplantis + 1 · Publicado 2019-12-11 · Atualizado 2022-06-17 · CVE-2019-5092

Positive Technologies (AI Summary)

CVSS v3.1

8.8

Alta

Vetor base

AV:N/AC:L/PR:N/UI:R/S:U/C:H/I:H/A:H

Name of the Vulnerable Software and Affected Versions LEADTOOLS version 20.0.2019.3.15

Description A heap out of bounds write issue exists in the UI tag parsing functionality of the DICOM image format. This can be triggered by a specially crafted DICOM image, potentially allowing code execution. An attacker can exploit this by crafting a DICOM image to cause an offset beyond the bounds of a heap allocation to be written.

Recommendations For LEADTOOLS version 20.0.2019.3.15, consider avoiding the use of specially crafted DICOM images until a fix is available. As a temporary workaround, restrict the processing of DICOM images from untrusted sources to minimize the risk of exploitation. At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Memory Corruption

Enumeração de Fraquezas

CWE-787

Identificadores relacionados

CVE-2019-5092

Produtos afetados

Leadtools

Referências · 3

• https://nvd.nist.gov/vuln/detail/CVE-2019-5092 · Nota de Segurança
• https://talosintelligence.com/vulnerability_reports/TALOS-2019-0884 · Nota
• https://osv.dev/vulnerability/CVE-2019-5092 · Aviso do Fabricante