PT-2019-8264 · Qualcomm · Snapdragon Automobile+3

Publicado 2019-05-06 · Atualizado 2019-05-07 · CVE-2017-18157

Positive Technologies (AI Summary)

CVSS v2.0

7.2

Alta

Vetor base

AV:L/AC:L/Au:N/C:C/I:C/A:C

Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20

Description A Use After Free Condition can occur in the Thermal Engine component of Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear. This issue may be related to memory management.

Recommendations For Qualcomm Snapdragon versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20, at the moment, there is no information about a newer version that contains a fix for this vulnerability.

Use After Free

Enumeração de Fraquezas

CWE-416

Identificadores relacionados

CVE-2017-18157

Produtos afetados

Snapdragon

Snapdragon Automobile

Snapdragon Mobile

Snapdragon Wear

Referências · 2

• https://qualcomm.com/company/product-security/bulletins · Aviso do Fabricante
• https://nvd.nist.gov/vuln/detail/CVE-2017-18157 · Nota de Segurança