PT-2019-8276 · Qualcomm · Qualcomm Snapdragon

Publicado 2019-01-03 · Atualizado 2019-01-10 · CVE-2017-18323

Positive Technologies (AI Summary)

CVSS v2.0

2.1

Baixa

Vetor base

AV:L/AC:L/Au:N/C:P/I:N/A:N

Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130.

Description A cryptographic key material leak was discovered in TDSCDMA RRC debug messages in Qualcomm Snapdragon automobile, mobile, and wear products. This issue may allow unauthorized access to sensitive information.

Recommendations For Qualcomm Snapdragon versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130, consider disabling TDSCDMA RRC debug messages to minimize the risk of exploitation until a patch is available. At the moment, there is no information about a newer version that contains a fix for this issue.

Correção

Enumeração de Fraquezas

CWE-320

Identificadores relacionados

CVE-2017-18323

Produtos afetados

Qualcomm Snapdragon

Referências · 3

• https://qualcomm.com/company/product-security/bulletins · Aviso do Fabricante
• http://securityfocus.com/bid/106128 · Nota
• https://nvd.nist.gov/vuln/detail/CVE-2017-18323 · Nota de Segurança