PT-2025-28453 · Qualcomm · Snapdragon+7

Conghui Wang · Publicado 2025-04-07 · Atualizado 2025-07-21 · CVE-2025-27058

Positive Technologies (AI Summary)

CVSS v3.1

7.8

Alta

Vetor base

AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Name of the Vulnerable Software and Affected Versions: The product name cannot be determined.

Description: The issue is related to memory corruption that occurs while processing packet data, specifically when dealing with exceedingly large packets.

Recommendations: At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Buffer Overflow

Enumeração de Fraquezas

CWE-120

Identificadores relacionados

BDU:2025-09980

CVE-2025-27058

Produtos afetados

Snapdragon

Fastconnect 6900 Firmware

Fastconnect 7800 Firmware

Sc8380Xp Firmware

Wcd9380 Firmware

Wcd9385 Firmware

Wsa8840 Firmware

Wsa8845 Firmware

Referências · 6

• https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.html · Aviso do Fabricante
• https://twitter.com/CVEnew/status/1942594396181955063 · Publicação no Twitter
• https://twitter.com/dailycve/status/1947409040570462285 · Publicação no Twitter
• https://t.me/cvenotify/129727 · Publicação no Telegram
• https://nvd.nist.gov/vuln/detail/CVE-2025-27058 · Nota de Segurança
• https://bdu.fstec.ru/vul/2025-09980 · Nota de Segurança