PT-2018-6813 · Qualcomm · Snapdragon

Published 2018-10-23 · Updated 2018-12-06 · CVE-2017-18295

Positive Technologies (AI Summary)

CVSS v2.0

7.2

High

Base vector

AV:L/AC:L/Au:N/C:C/I:C/A:C

Name of the Vulnerable Software and Affected Versions: Qualcomm Snapdragon versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDX20

Description: A buffer overflow issue may occur in the DSP Service module if the input is not null-terminated. This issue affects various Qualcomm Snapdragon versions used in automobile, mobile, and wear devices.

Recommendations: For versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDX20, ensure that all input to the DSP Service module is properly null-terminated to prevent buffer overflow. At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Buffer Overflow

Weakness Enumeration

CWE-119

Related Identifiers

CVE-2017-18295

Affected Products

Snapdragon

References · 4

• https://nvd.nist.gov/vuln/detail/CVE-2017-18295 · Security Note
• https://qualcomm.com/company/product-security/bulletins · Vendor Advisory
• https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components · Note
• http://securitytracker.com/id/1041432 · Note