PT-2018-6815 · Qualcomm · Snapdragon Mobile

Published 2018-10-23 · Updated 2018-12-07 · CVE-2017-18297

Positive Technologies (AI Summary)

CVSS v2.0

7.2

High

Base vector

AV:L/AC:L/Au:N/C:C/I:C/A:C

Name of the Vulnerable Software and Affected Versions: Qualcomm Snapdragon Mobile versions SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820

Description: The issue arises from a double memory free error that occurs while closing the TEE SE API Session management in Snapdragon Mobile.

Recommendations: For versions SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, at the moment, there is no information about a newer version that contains a fix for this vulnerability.

Double Free

Weakness Enumeration

CWE-415

Related Identifiers

CVE-2017-18297

Affected Products

Snapdragon Mobile

References · 4

• https://nvd.nist.gov/vuln/detail/CVE-2017-18297 · Security Note
• https://qualcomm.com/company/product-security/bulletins · Vendor Advisory
• https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components · Note
• http://securitytracker.com/id/1041432 · Note