PT-2019-8272 · Qualcomm · Snapdragon

Published 2019-01-03 · Updated 2019-01-10 · CVE-2017-18319

Positive Technologies (AI Summary)

CVSS v2.0

2.1

Low

Base vector

AV:L/AC:L/Au:N/C:P/I:N/A:N

Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon High Med 2016

Description The issue is related to an information leak in UIM API debug messages. This could potentially expose sensitive information.

Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Weakness Enumeration

CWE-320

Related Identifiers

CVE-2017-18319

Affected Products

Snapdragon

References · 3

• https://qualcomm.com/company/product-security/bulletins · Vendor Advisory
• https://nvd.nist.gov/vuln/detail/CVE-2017-18319 · Security Note
• http://securityfocus.com/bid/106128 · Note