PT-2019-8276 · Qualcomm · Qualcomm Snapdragon

Published 2019-01-03 · Updated 2019-01-10 · CVE-2017-18323

Positive Technologies (AI Summary)

CVSS v2.0

2.1

Low

Base vector

AV:L/AC:L/Au:N/C:P/I:N/A:N

Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130.

Description A cryptographic key material leak was discovered in TDSCDMA RRC debug messages in Qualcomm Snapdragon automobile, mobile, and wear products. This issue may allow unauthorized access to sensitive information.

Recommendations For Qualcomm Snapdragon versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130, consider disabling TDSCDMA RRC debug messages to minimize the risk of exploitation until a patch is available. At the moment, there is no information about a newer version that contains a fix for this issue.

Fix

Weakness Enumeration

CWE-320

Related Identifiers

CVE-2017-18323

Affected Products

Qualcomm Snapdragon

References · 3

• https://qualcomm.com/company/product-security/bulletins · Vendor Advisory
• https://nvd.nist.gov/vuln/detail/CVE-2017-18323 · Security Note
• http://securityfocus.com/bid/106128 · Note