PT-2019-8277 · Qualcomm · Snapdragon

Published 2019-01-03 · Updated 2019-10-03 · CVE-2017-18324

Positive Technologies (AI Summary)

CVSS v2.0

2.1

Low

Base vector

AV:L/AC:L/Au:N/C:P/I:N/A:N

Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon High Med 2016

Description A cryptographic key material leak has been identified in debug messages, specifically affecting the GERAN in Snapdragon mobile and Snapdragon wear.

Recommendations For versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon High Med 2016, consider disabling debug messages to prevent key material leakage until a patch is available. Restrict access to sensitive areas where debug messages may be exposed to minimize the risk of exploitation.

Fix

Information Disclosure

Weakness Enumeration

CWE-200

Related Identifiers

CVE-2017-18324

Affected Products

Snapdragon

References · 3

• https://qualcomm.com/company/product-security/bulletins · Vendor Advisory
• https://nvd.nist.gov/vuln/detail/CVE-2017-18324 · Security Note
• http://securityfocus.com/bid/106128 · Note