PT-2020-10085 · Telink Semiconductor · Telink Semiconductor Ble Sdk

Published 2020-02-12 · Updated 2020-02-25 · CVE-2019-19196

Positive Technologies (AI Summary)

CVSS v3.1

6.5

Medium

Base vector

AV:A/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H

Name of the Vulnerable Software and Affected Versions Telink Semiconductor BLE SDK versions prior to November 2019 for TLSR8x5x through 3.4.0 Telink Semiconductor BLE SDK versions prior to November 2019 for TLSR823x through 1.3.0 Telink Semiconductor BLE SDK versions prior to November 2019 for TLSR826x through 3.3

Description The Bluetooth Low Energy Secure Manager Protocol implementation accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service via crafted packets.

Recommendations For Telink Semiconductor BLE SDK versions prior to November 2019 for TLSR8x5x through 3.4.0, update to a version from November 2019 or later. For Telink Semiconductor BLE SDK versions prior to November 2019 for TLSR823x through 1.3.0, update to a version from November 2019 or later. For Telink Semiconductor BLE SDK versions prior to November 2019 for TLSR826x through 3.3, update to a version from November 2019 or later.

Exploit

Fix

Buffer Overflow

Weakness Enumeration

CWE-120

Related Identifiers

CVE-2019-19196

Affected Products

Telink Semiconductor Ble Sdk

References · 4

• 🔥 https://asset-group.github.io/disclosures/sweyntooth · Exploit
• https://nvd.nist.gov/vuln/detail/CVE-2019-19196 · Security Note
• http://telink-semi.com/ble · Vendor Advisory
• https://osv.dev/vulnerability/CVE-2019-19196 · Vendor Advisory