PT-2020-12570 · Qualcomm · Snapdragon

Published 2020-09-08 · Updated 2020-09-14 · CVE-2020-11133

Positive Technologies (AI Summary)

CVSS v2.0

4.6

Medium

Base vector

AV:L/AC:L/Au:N/C:P/I:P/A:P

Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon versions (affected versions not specified)

Description The issue is related to a possible out of bound array write in the rxdco cal utility due to a lack of array bound check. This affects various Snapdragon products, including Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, and Snapdragon Mobile, in specific chipsets such as MSM8998, QCS605, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, and SXR1130.

Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Buffer Overflow

Weakness Enumeration

CWE-120

Related Identifiers

CVE-2020-11133

Affected Products

Snapdragon

References · 3

• https://nvd.nist.gov/vuln/detail/CVE-2020-11133 · Security Note
• https://qualcomm.com/company/product-security/bulletins/august-2020-security-bulletin · Vendor Advisory
• https://qualcomm.com/company/product-security/bulletins/august-2020-bulletin · Note