PT-2020-12574 · Qualcomm · Snapdragon Connectivity+8

Published 2020-11-02 · Updated 2020-11-03 · CVE-2020-11154

Positive Technologies (AI Summary)

CVSS v2.0

8.3

High

Base vector

AV:A/AC:L/Au:N/C:C/I:C/A:C

Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon versions (affected versions not specified)

Description A buffer overflow issue occurs while processing a crafted PDU data packet in Bluetooth due to the lack of buffer size checks before copying. This issue affects various Qualcomm Snapdragon products, including Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, and Snapdragon Wired Infrastructure and Networking.

Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Buffer Overflow

Weakness Enumeration

CWE-120

Related Identifiers

CVE-2020-11154

Affected Products

Snapdragon Auto

Snapdragon Compute

Snapdragon Connectivity

Snapdragon Consumer Electronics Connectivity

Snapdragon Consumer Iot

Snapdragon Industrial Iot

Snapdragon Mobile

Snapdragon Voice & Music

Snapdragon Wired Infrastructure/Networking

References · 3

• https://nvd.nist.gov/vuln/detail/CVE-2020-11154 · Security Note
• https://qualcomm.com/company/product-security/bulletins/october-2020-security-bulletin · Vendor Advisory
• https://qualcomm.com/company/product-security/bulletins/october-2020-bulletin · Note