PT-2020-17598 · Qualcomm · Snapdragon Wearables+15

Published 2020-09-08 · Updated 2020-09-14 · CVE-2020-3629

Positive Technologies (AI Summary)

CVSS v2.0

4.6

Medium

Base vector

AV:L/AC:L/Au:N/C:P/I:P/A:P

Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon versions (affected versions not specified)

Description A stack out of bound issue occurs when making a query to DSP capabilities due to a wrong assumption made on determining the buffer size for the DSP attributes. This issue affects various Snapdragon products, including Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, and Snapdragon Wearables, in several chipsets such as Bitra, Kamorta, Rennell, SC7180, SDM845, SM6150, SM7150, SM8150, SM8250, and SXR2130.

Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Buffer Overflow

Weakness Enumeration

CWE-120

Related Identifiers

CVE-2020-3629

Affected Products

Bitra

Kamorta

Sc7180

Sdm845

Sm6150

Sm7150

Sm8150

Sm8250

Sxr2130

Snapdragon Auto

Snapdragon Compute

Snapdragon Consumer Iot

Snapdragon Industrial Iot

Snapdragon Mobile

Snapdragon Voice & Music

Snapdragon Wearables

References · 3

• https://nvd.nist.gov/vuln/detail/CVE-2020-3629 · Security Note
• https://qualcomm.com/company/product-security/bulletins/august-2020-security-bulletin · Vendor Advisory
• https://qualcomm.com/company/product-security/bulletins/august-2020-bulletin · Note