PT-2020-9910 · Dialog Semiconductor · Dialog Semiconductor Sdk

Published 2020-02-10 · Updated 2021-02-11 · CVE-2019-17517

Positive Technologies (AI Summary)

CVSS v2.0

6.1

Medium

Base vector

AV:A/AC:L/Au:N/C:N/I:N/A:C

Name of the Vulnerable Software and Affected Versions Dialog Semiconductor SDK versions through 5.0.4 for DA14580/1/2/3 devices

Description The Bluetooth Low Energy implementation does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet.

Recommendations For versions through 5.0.4, consider restricting access to the Bluetooth Low Energy implementation until a patch is available. As a temporary workaround, avoid using the L2CAP protocol in the affected devices until the issue is resolved. At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Buffer Overflow

Weakness Enumeration

CWE-120

Related Identifiers

CVE-2019-17517

Affected Products

Dialog Semiconductor Sdk

References · 6

• https://nvd.nist.gov/vuln/detail/CVE-2019-17517 · Security Note
• https://osv.dev/vulnerability/CVE-2019-17517 · Vendor Advisory
• https://asset-group.github.io/disclosures/sweyntooth · Note
• https://dialog-semiconductor.com/products/connectivity/bluetooth-low-energy/smartbond-da14580-and-da14583 · Note
• https://t.me/cvenotify/9366 · Telegram Post
• https://t.me/cvenotify/9793 · Telegram Post