PT-2021-5598 · Qualcomm · Snapdragon Connectivity+8

Published 2021-11-01 · Updated 2021-11-16 · CVE-2021-1973

Positive Technologies (AI Summary)

CVSS v3.1

7.8

High

Base vector

AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables (affected versions not specified)

Description The issue is related to a buffer overflow in the FTM Diag command implementation in Qualcomm's embedded software, allowing an arbitrary write into the modem OS space. This can be exploited to enable a malicious actor to write into the modem's operating system space.

Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Buffer Overflow

Weakness Enumeration

CWE-119

Related Identifiers

BDU:2022-00032

CVE-2021-1973

Affected Products

Snapdragon Auto

Snapdragon Compute

Snapdragon Connectivity

Snapdragon Consumer Iot

Snapdragon Industrial Iot

Snapdragon Iot

Snapdragon Mobile

Snapdragon Voice & Music

Snapdragon Wearables

References · 6

• https://bdu.fstec.ru/vul/2022-00032 · Security Note
• https://qualcomm.com/company/product-security/bulletins/november-2021-bulletin · Vendor Advisory
• https://nvd.nist.gov/vuln/detail/CVE-2021-1973 · Security Note
• http://qualcomm.com/company/product-security/bulletins/november-2021-bulletin · Note
• https://t.me/cvenotify/23318 · Telegram Post
• https://t.me/cibsecurity/32291 · Telegram Post