PT-2021-9187 · Qualcomm · Qualcomm Snapdragon

Published 2021-01-21 · Updated 2021-07-21 · CVE-2020-11144

Positive Technologies (AI Summary)

CVSS v2.0

6.4

Medium

Base vector

AV:N/AC:L/Au:N/C:P/I:N/A:P

Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon (affected versions not specified)

Description The issue arises from a buffer over-read that occurs when a UE process attempts to decompress an invalid DL ROHC packet. This happens due to the lack of a size check for the compressed packet in various Snapdragon components, including Auto, Compute, Connectivity, Consumer IOT, Industrial IOT, IoT, Mobile, Voice & Music, and Wearables.

Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.

RCE

Out of bounds Read

Weakness Enumeration

CWE-20

CWE-125

Related Identifiers

CVE-2020-11144

Affected Products

Qualcomm Snapdragon

References · 3

• https://qualcomm.com/company/product-security/bulletins/december-2020-security-bulletin · Vendor Advisory
• https://nvd.nist.gov/vuln/detail/CVE-2020-11144 · Security Note
• https://qualcomm.com/company/product-security/bulletins/december-2020-bulletin · Note