PT-2021-9252 · Qualcomm · Snapdragon Connectivity+8

Published 2021-03-10 · Updated 2021-06-15 · CVE-2020-11239

Positive Technologies (AI Summary)

CVSS v2.0

7.2

High

Base vector

AV:L/AC:L/Au:N/C:C/I:C/A:C

Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon (affected versions not specified)

Description The issue is related to a use after free problem that occurs when importing a DMA buffer using the CPU address of the buffer. This happens because the attachment is not properly cleaned up. The affected products include Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, and Snapdragon Wearables.

Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Use After Free

Weakness Enumeration

CWE-416

Related Identifiers

CVE-2020-11239

Affected Products

Snapdragon

Snapdragon Auto

Snapdragon Compute

Snapdragon Connectivity

Snapdragon Consumer Iot

Snapdragon Industrial Iot

Snapdragon Mobile

Snapdragon Voice & Music

Snapdragon Wearables

References · 8

• https://qualcomm.com/company/product-security/bulletins/january-2021-bulletin · Vendor Advisory
• https://nvd.nist.gov/vuln/detail/CVE-2020-11239 · Security Note
• https://t.me/cvenotify/15965 · Telegram Post
• https://t.me/cybersecuritytechnologies/2885 · Telegram Post
• https://t.me/freedomf0x/12447 · Telegram Post
• https://t.me/ckure/7358 · Telegram Post
• https://t.me/cvenotify/15952 · Telegram Post
• https://t.me/linkersec/74 · Telegram Post