PT-2022-15232 · Qualcomm · Qualcomm Snapdragon Connectivity+1

Lei Ai + 1 · Published 2022-09-02 · Updated 2023-04-19 · CVE-2022-22096

Positive Technologies (AI Summary)

CVSS v3.1

9.8

Critical

Base vector

AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon Connectivity and Snapdragon Mobile (affected versions not specified)

Description The issue is related to memory corruption in the Bluetooth HOST component due to a stack-based buffer overflow. This occurs when extracting data using the command length parameter.

Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Memory Corruption

Weakness Enumeration

CWE-787

Related Identifiers

CVE-2022-22096

Affected Products

Qualcomm Snapdragon Connectivity

Qualcomm Snapdragon Mobile

References · 2

• https://nvd.nist.gov/vuln/detail/CVE-2022-22096 · Security Note
• https://qualcomm.com/company/product-security/bulletins/july-2022-bulletin · Vendor Advisory