PT-2022-21749 · Qualcomm · Qualcomm Ipc

Chen Gengjia · CVE-2022-33217 · Published 2022-10-17 · Updated 2023-04-19

Positive Technologies (AI Summary)

CVSS v3.1

7.8

High

Base vector

AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Name of the Vulnerable Software and Affected Versions Qualcomm IPC in Snapdragon Mobile (affected versions not specified)

Description The issue is related to memory corruption in Qualcomm IPC due to a buffer copy without checking the size of the input while starting communication with a compromised kernel.

Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Buffer Overflow

Weakness Enumeration

CWE-120

Related Identifiers

CVE-2022-33217

Affected Products

Qualcomm Ipc

References · 3

• https://qualcomm.com/company/product-security/bulletins/october-2022-bulletin · Vendor Advisory
• https://nvd.nist.gov/vuln/detail/CVE-2022-33217 · Security Note
• https://t.me/cibsecurity/51762 · Telegram Post