PT-2022-25698 · Sap · Sap 3D Visual Enterprise Author

Published 2022-10-11 · Updated 2023-07-10 · CVE-2022-41175

Positive Technologies (AI Summary)

CVSS v3.1

7.8

High

Base vector

AV:L/AC:L/PR:N/UI:R/S:U/C:H/I:H/A:H

Name of the Vulnerable Software and Affected Versions SAP 3D Visual Enterprise Author version 9

Description The issue arises due to improper memory management when handling Enhanced Metafile (.emf, emf.x3d) files from untrusted sources. This can lead to Remote Code Execution when a manipulated file forces a stack-based overflow or reuses a dangling pointer referring to overwritten memory space.

Recommendations For SAP 3D Visual Enterprise Author version 9, consider avoiding the use of .emf and emf.x3d files from untrusted sources until a patch is available. As a temporary workaround, restrict the parsing of EMF files to minimize the risk of exploitation. At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Memory Corruption

Buffer Overflow

Weakness Enumeration

CWE-787

CWE-119

Related Identifiers

CVE-2022-41175

ZDI-22-1551

ZDI-22-1656

Affected Products

Sap 3D Visual Enterprise Author

References · 6

• https://zerodayinitiative.com/advisories/ZDI-22-1656 · Security Note
• https://sap.com/documents/2022/02/fa865ea4-167e-0010-bca6-c68f7e60039b.html · Vendor Advisory
• https://launchpad.support.sap.com/#/notes/3245929 · Vendor Advisory
• https://zerodayinitiative.com/advisories/ZDI-22-1551 · Security Note
• https://nvd.nist.gov/vuln/detail/CVE-2022-41175 · Security Note
• https://osv.dev/vulnerability/CVE-2022-41175 · Vendor Advisory