PT-2022-9977 · Qualcomm · Snapdragon Mobile+5

Published 2022-01-13 · Updated 2023-04-19 · CVE-2021-30308

Positive Technologies (AI Summary)

CVSS v3.1

7.8

High

Base vector

AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Name of the Vulnerable Software and Affected Versions Snapdragon Auto (affected versions not specified) Snapdragon Compute (affected versions not specified) Snapdragon Connectivity (affected versions not specified) Snapdragon Consumer IOT (affected versions not specified) Snapdragon Industrial IOT (affected versions not specified) Snapdragon Mobile (affected versions not specified)

Description The issue is related to a possible buffer overflow while printing the HARQ memory partition detail. This occurs due to improper validation of buffer size.

Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Buffer Overflow

Weakness Enumeration

CWE-120

Related Identifiers

CVE-2021-30308

Affected Products

Snapdragon Auto

Snapdragon Compute

Snapdragon Connectivity

Snapdragon Consumer Iot

Snapdragon Industrial Iot

Snapdragon Mobile

References · 4

• https://qualcomm.com/company/product-security/bulletins/january-2022-bulletin · Vendor Advisory
• https://nvd.nist.gov/vuln/detail/CVE-2021-30308 · Security Note
• https://t.me/cvenotify/25384 · Telegram Post
• https://t.me/cibsecurity/35398 · Telegram Post