PT-2023-1617 · Qualcomm · Qualcomm Embedded Platform

Published 2023-01-05 · Updated 2025-04-09 · CVE-2022-33265

Positive Technologies (AI Summary)

CVSS v2.0

7.5

High

Base vector

AV:N/AC:L/Au:N/C:P/I:P/A:P

Name of the Vulnerable Software and Affected Versions Powerline Communication Firmware (affected versions not specified) Qualcomm embedded platform software (affected versions not specified)

Description The issue is related to memory corruption due to information exposure in Powerline Communication Firmware when sending different MMEs from a single, unassociated device. There is also a vulnerability in Qualcomm's embedded platform software related to the lack of protection for service data, which can allow a remote attacker to disclose protected information.

Recommendations For Powerline Communication Firmware, at the moment, there is no information about a newer version that contains a fix for this vulnerability. For Qualcomm embedded platform software, at the moment, there is no information about a newer version that contains a fix for this vulnerability.

Memory Corruption

Information Disclosure

Weakness Enumeration

CWE-787

CWE-200

Related Identifiers

BDU:2023-01126

CVE-2022-33265

Affected Products

Qualcomm Embedded Platform

References · 8

• https://qualcomm.com/company/product-security/bulletins/january-2023-bulletin · Vendor Advisory
• https://nvd.nist.gov/vuln/detail/CVE-2022-33265 · Security Note
• https://bdu.fstec.ru/vul/2023-01126 · Security Note
• https://t.me/cvenotify/41548 · Telegram Post
• https://t.me/cvenotify/118455 · Telegram Post
• https://docs.qualcomm.com/product/publicresources/securitybulletin/january-2023-bulletin.html · Note
• https://cybersecurity-help.cz/vdb/SB2023011085 · Note
• https://t.me/true_secator/3920 · Telegram Post