PT-2023-18297 · Qualcomm · Qualcomm Chipsets

Published 2023-12-04 · Updated 2024-04-12 · CVE-2023-21634

Positive Technologies (AI Summary)

CVSS v3.1

6.7

Medium

Base vector

AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H

Name of the Vulnerable Software and Affected Versions Qualcomm Chipsets (affected versions not specified)

Description The issue is related to memory corruption in the Radio Interface Layer, which occurs when sending an SMS or writing an SMS to the SIM. This can potentially lead to code execution.

Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Buffer Overflow

Memory Corruption

Weakness Enumeration

CWE-119

CWE-787

Related Identifiers

CVE-2023-21634

Affected Products

Qualcomm Chipsets

References · 7

• https://qualcomm.com/company/product-security/bulletins/december-2023-bulletin · Vendor Advisory
• https://nvd.nist.gov/vuln/detail/CVE-2023-21634 · Security Note
• https://twitter.com/VulmonFeeds/status/1731953369034494239 · Twitter Post
• https://t.me/cvenotify/62255 · Telegram Post
• https://twitter.com/RedPacketSec/status/1732704539713642754 · Twitter Post
• https://t.me/cvenotify/76606 · Telegram Post
• https://twitter.com/CVEnew/status/1731880652277158373 · Twitter Post