PT-2023-24167 · Qualcomm · Qualcomm Multiple Chipsets

Published 2023-10-03 · Updated 2024-06-17 · CVE-2023-33063

Positive Technologies (AI Summary)

CVSS v2.0

10

High

Base vector

AV:N/AC:L/Au:N/C:C/I:C/A:C

Name of the Vulnerable Software and Affected Versions Qualcomm Multiple Chipsets (affected versions not specified)

Description The issue concerns memory corruption in DSP Services during a remote call from HLOS to DSP. No information is provided about the estimated number of potentially affected devices worldwide or real-world incidents where this issue was exploited.

Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Use After Free

Weakness Enumeration

CWE-416

Related Identifiers

BDU:2025-13122

CVE-2023-33063

Affected Products

Qualcomm Multiple Chipsets

References · 17

• https://qualcomm.com/company/product-security/bulletins/december-2023-bulletin · Vendor Advisory
• https://nvd.nist.gov/vuln/detail/CVE-2023-33063 · Security Note
• https://bdu.fstec.ru/vul/2025-13122 · Security Note
• https://bleepingcomputer.com/news/security/qualcomm-says-hackers-exploit-3-zero-days-in-its-gpu-dsp-drivers · Note
• https://twitter.com/CVEnew/status/1731880632631112038 · Twitter Post
• https://cisa.gov/sites/default/files/csv/known_exploited_vulnerabilities.csv · Note
• https://securityonline.info/four-zero-day-vulnerabilities-in-qualcomm-chips-put-billions-of-users-at-risk · Note
• https://twitter.com/inthewildio/status/1709888560071901443 · Twitter Post
• https://twitter.com/fluidattacks/status/1735774984776130860 · Twitter Post
• https://t.me/true_secator/4924 · Telegram Post
• https://twitter.com/LindseyOD123/status/1709234811963883950 · Twitter Post
• https://t.me/cvenotify/63189 · Telegram Post
• https://twitter.com/VulmonFeeds/status/1731944860423168105 · Twitter Post
• https://t.me/cvenotify/83476 · Telegram Post
• https://docs.qualcomm.com/product/publicresources/securitybulletin · Note