PT-2024-25085 · Qualcomm · Snapdragon+28

Published 2024-12-02 · Updated 2024-12-12 · CVE-2024-33040

Positive Technologies (AI Summary)

CVSS v3.1

7.0

High

Base vector

AV:L/AC:H/PR:L/UI:N/S:U/C:H/I:H/A:H

Name of the Vulnerable Software and Affected Versions No specific software or versions are mentioned in the provided descriptions.

Description Memory corruption can occur due to a race condition in kernel space between buffer release and buffer access when invoking a redundant release command to release a buffer from user space. This issue arises from the invocation of the redundant release command.

Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Use After Free

Weakness Enumeration

CWE-416

Related Identifiers

CVE-2024-33040

Affected Products

Snapdragon

Fastconnect 6800 Firmware

Fastconnect 6900 Firmware

Fastconnect 7800 Firmware

Qam8255P Firmware

Qca6391 Firmware

Qca6426 Firmware

Qca6436 Firmware

Qca6595Au Firmware

Qca6678Aq Firmware

Sa8255P Firmware

Sd865 5G Firmware

Snapdragon 865 5G Mobile Platform Firmware

Snapdragon 870 5G Mobile Platform Firmware

Snapdragon 8 Gen 1 Mobile Platform Firmware

Snapdragon W5+ Gen 1 Wearable Platform Firmware

Snapdragon X55 5G Modem-Rf System Firmware

Snapdragon Xr2 5G Platform Firmware

Sw5100P Firmware

Sxr2130 Firmware

Wcd9380 Firmware

Wcn3660B Firmware

Wcn3680B Firmware

Wcn3980 Firmware

Wcn3988 Firmware

Wsa8810 Firmware

Wsa8815 Firmware

Wsa8830 Firmware

Wsa8835 Firmware

References · 6

• https://docs.qualcomm.com/product/publicresources/securitybulletin/december-2024-bulletin.html · Vendor Advisory
• https://nvd.nist.gov/vuln/detail/CVE-2024-33040 · Security Note
• https://twitter.com/CVEnew/status/1863533977488794107 · Twitter Post
• https://twitter.com/VulmonFeeds/status/1864049440257937627 · Twitter Post
• https://t.me/cvenotify/102786 · Telegram Post
• https://t.me/cvedetector/11757 · Telegram Post