PT-2024-5261 · Qualcomm · Qualcomm Embedded Platform

Published 2024-01-01 · Updated 2024-07-04 · CVE-2024-21469

Positive Technologies (AI Summary)

CVSS v3.1

7.3

High

Base vector

AV:L/AC:L/PR:L/UI:N/S:U/C:L/I:H/A:H

Name of the Vulnerable Software and Affected Versions: Qualcomm embedded platform software (affected versions not specified)

Description: The issue is related to a memory corruption problem that occurs when an invoke call and a TEE call are bound for the same trusted application. It is also associated with flaws in the access control mechanism of the TZ Secure OS microprogram component. This could potentially allow an attacker to execute arbitrary code.

Recommendations: At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Memory Corruption

Weakness Enumeration

CWE-787

CWE-264

Related Identifiers

BDU:2024-05877

CVE-2024-21469

Affected Products

Qualcomm Embedded Platform

References · 5

• https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2024-bulletin.html · Vendor Advisory
• https://nvd.nist.gov/vuln/detail/CVE-2024-21469 · Security Note
• https://bdu.fstec.ru/vul/2024-05877 · Security Note
• https://twitter.com/cracbot/status/1809105060493979911 · Twitter Post
• http://source.android.com/docs/security/bulletin/2024-07-01 · Note