PT-2025-23585 · Qualcomm · Snapdragon+18

Published 2025-03-03 · Updated 2025-08-20 · CVE-2025-27031

Positive Technologies (AI Summary)

CVSS v3.1

7.8

High

Base vector

AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Name of the Vulnerable Software and Affected Versions The product name cannot be determined.

Description The issue involves memory corruption during the processing of IOCTL commands. This occurs when the buffer in write loopback mode is accessed after being freed.

Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.

Use After Free

Weakness Enumeration

CWE-416

Related Identifiers

BDU:2025-06486

CVE-2025-27031

Affected Products

Snapdragon

Fastconnect 6700 Firmware

Fastconnect 6900 Firmware

Fastconnect 7800 Firmware

Qcs5430 Firmware

Qcs6490 Firmware

Sc8380Xp Firmware

Snapdragon 7C+ Gen 3 Compute Firmware

Snapdragon 8Cx Gen 3 Compute Platform (Sc8280Xp-Ab

Snapdragon 8Cx Gen 3 Compute Platform (Sc8280Xp-Bb) Firmware

Video Collaboration Vc3 Platform Firmware

Wcd9370 Firmware

Wcd9375 Firmware

Wcd9380 Firmware

Wcd9385 Firmware

Wsa8830 Firmware

Wsa8835 Firmware

Wsa8840 Firmware

Wsa8845 Firmware

References · 9

• https://nvd.nist.gov/vuln/detail/CVE-2025-27031 · Security Note
• https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html · Vendor Advisory
• https://bdu.fstec.ru/vul/2025-06486 · Security Note
• https://t.me/cveNotify/132946 · Telegram Post
• https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html#_cve-2025-27031 · Note
• https://t.me/cvetracker/25244 · Telegram Post
• https://twitter.com/CVEnew/status/1929785818199024008 · Twitter Post
• https://twitter.com/cracbot/status/1931667585776672864 · Twitter Post
• https://t.me/latest_high_impact_cve/2526 · Telegram Post