PT-2025-28446 · Qualcomm · Snapdragon+18

Heidada + 1 · Published 2024-10-27 · Updated 2025-07-21 · CVE-2025-27047

Positive Technologies (AI Summary)

CVSS v3.1

7.8

High

Base vector

AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Name of the Vulnerable Software and Affected Versions: The product name cannot be determined.

Description: Memory corruption occurs while processing the TESTPATTERNCONFIG escape path.

Recommendations: At the moment, there is no information about a newer version that contains a fix for this issue.

Fix

Use After Free

Weakness Enumeration

CWE-416

Related Identifiers

BDU:2025-09568

CVE-2025-27047

Affected Products

Snapdragon

Fastconnect 6700 Firmware

Fastconnect 6900 Firmware

Fastconnect 7800 Firmware

Qcs5430 Firmware

Qcs6490 Firmware

Sc8280Xp-Abbb Firmware

Sc8380Xp Firmware

Snapdragon 7C+ Gen 3 Compute Firmware

Video Collaboration Vc3 Firmware

Video Collaboration Vc3 Platform Firmware

Wcd9370 Firmware

Wcd9375 Firmware

Wcd9380 Firmware

Wcd9385 Firmware

Wsa8830 Firmware

Wsa8835 Firmware

Wsa8840 Firmware

Wsa8845 Firmware

References · 5

• https://bdu.fstec.ru/vul/2025-09568 · Security Note
• https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.html · Vendor Advisory
• https://nvd.nist.gov/vuln/detail/CVE-2025-27047 · Security Note
• https://twitter.com/CVEnew/status/1942594403031306747 · Twitter Post
• https://t.me/cvenotify/129731 · Telegram Post